Nothing Stacks Up To EPYC™
New AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ are designed to accelerate technical computing13 workloads such as Electronic Design Automation (EDA), Computational Fluid Dynamics (CFD), and Finite Element Analysis (FEA) by vertically stacking the L3 cache using ground-breaking AMD 3D Chiplet architecture with 768MBs of L3 cache per socket while providing socket compatibility with existing AMD EPYC™ 7003-based platforms7. The industry-leading 768MB of L3 cache keeps memory intensive compute closer to the core, with an EPYC 7373X powered server able to perform up to 66% more EDA RTL simulation jobs a day than an EPYC 73F3 powered server with the same number of cores.3
Raising the bar for breakthrough performance on targeted workloads like EDA, CFD and FEA software and solutions, EPYC 7003 Processors with AMD 3D V-cache are helping optimize simulation performance to accelerate the development of new products and technologies. Socket compatible with existing 3rd Gen AMD EPYC platforms7, these new processors with AMD 3D VCache work with your existing software solutions to get up and running quickly, to help drive better business outcomes.
- AMD 3D V-Cache technology: Built on ground-breaking AMD 3D Chiplet architecture and using 7nm process technology, AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology employ the leading-edge logic stacking based on a copper-to-copper hybrid bonding "bumpless" chip-on-wafer process to enable over 200X the interconnect densities of current 2D CPU technologies (and over lSX the interconnect densities of other 3D CPU technologies using solder bumps), helping lower latency, boost bandwidth, and enhance power and thermal efficiencies9.
- World's Highest Performance x86 Server Processors for Technical Computing14 ; AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology triple the amount of available L3 cache to 768MBs per socket versus standard EPYC 7003 series8, helping deliver faster time-to-results on targeted workloads like EDA, CFD, and FEA software and solutions by helping customers complete up to 66% more EDA RTL simulation jobs a day with an EPYC 7373X powered server than an EPYC 73F3 powered server with the same number of cores. while providing socket compatibility with existing AMD EPYC™ 7003 platforms.3,7 AMD EPYC™ 7003 Processors with AMD 3D VCache utilizes the same shared memory architecture as the rest of the 3rd Generation EPYC™ family to take advantage of the increased L3 cache that is lower latency and closer to the core. That means customers can now take advantage of a full 96MB of L3 cache per CCD without sacrificing performance, even on lower core count and mainstream EPYC 7003 with AMD 3D V-Cache processors.
- Helping Lower TCO while Accelerating Product Development: AM D 3rd Gen EPYC™ Processors with AMD 3D V-Cache™ technology help customers optimize core usage, license costs and lower total cost-ofownership. In fact, AMD EPYC™ 32c 7573X CPU powered servers can deliver up to 51% lower 3-year TCO than Intel Platinum 32c 8362 CPUs, while performing the same number of Ansys® cfx-50 jobs per day with up to 50% fewer servers and 49% less power.12 By reducing the number of servers and core counts, helping drive down license requirements and lower TCO while performing the same amount of work, AMD EPYC™ 7573X CPUs help maximize performance while optimizing costly job or time-based licensing.
- Delivering Breakthrough Performance Per Core: AMD EPYC™ 7003 Processors with AMD 3D V-Cacher"' technology can run on existing AMD EPYC™ 7003 platforms.7 Built to optimize applications like EDA, CFD, and FEA, customers can realize up to 66% more performance on EDA RTL simulations going from an EPYC 73F3 to an EPYC 7373X in their 1P servers without needing to wait for application re-writes, by taking advantage of the additional L3 cache immediately.3 Having access to 768MB of L3 cache helps improve performance and speeds up simulation workloads by continuously feeding the processor with up to 96MB of L3 cache per CCD without having to access main memory outside of the CPU.
- Supporting Sustainability through Exceptional Energy Efficiency: AMD is charting a bold path to advance energy efficiency. AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology powered servers performing the same number of Ansys® cfx-50 jobs per day deliver exceptional performance per server which can lead to up to 49% less power used with 50% fewer total servers than the competition. The power you save, converts to ~448,315kWh of electricity or ~s1 acres of US forest annually of equivalent carbon sequestration.12 AMD EPYC™ 7003 Processors with AMD 3D V-Cache is a great choice for customers who want to use fewer servers and less power to help lower emissions.
- Providing the Confidence of Modern Security: AMD is serious about security. All AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology come standard with Infinity Guard, a state-of-the-art set of modern security features that help decrease potential attack surfaces as software is booted, executed, and processes your critical data.1
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To find out more about AMD's new product range of AMD EPYC™ 7003 Processors, get in touch with our Sales team who are ready to help meet your requirements by calling us on 01727 876100 or emailing us at [email protected].
ENDNOTES/CLAIMS
1GD-177: AMD Infinity Guard security features on EPYC™ processors must be enabled by server OEMs and/or Cloud Service Providers to operate. Check with your OEM or provider to confirm support of these features. Learn more about Infinity Guard at https://www.amd.com/en/technologies/infinity-guard.
2EPYC-022: For a complete list of world records see http://amd.com/worldrecords
3MLNX-00lA: EDA RTL Simulation comparison based on AMD internal testing completed on 9/20/2021 measuring the average time to complete a test case simulation. comparing: lx 16C EPYC™ 7373X with AMD 3D V-Cache Technology versus lx 16C AMD EPYC™ 73F3 on the same AMD "Daytona" reference platform. Results may vary based on factors including silicon version, hardware and software configuration and driver versions.
4MLNX-002C: ANSYS® CFX® 2022.1 comparison based on AMD internal testing as of 2/14/2022 measuring the time to run the cfx_l0, cfx_S0, cfx_lO0, cfx_lmans, and cfx_pump test case simulations. CFX_l0 is the max result. Configurations: 2x 64C AMD EPYC™ 7773X with AMD 3D V-Cache TM versus 2x 64C AMD EPYC 7763 on the same AMD "Daytona" reference platform. Results may vary based on factors including silicon version, hardware and software configuration and driver versions.
5MLNX-00SA: ANSYS® Mechanical® 2021.1 comparison based on AMD internal testing as of 09/27/2021 measuring the core solver rating for the Release 19.0 R2 test case simulations. Configurations: 2x 32C AMD EPYC 7573X with AMD 3D V-Cache Technology ("Milan-X") versus 2x 32C EPYC 75F3 on the same AMD "Daytona" reference platform. Results may vary based on factors including silicon version, hardware and software configuration and driver versions. CGl is the max result.
6MLNX-006C: ANSYS® LS-DYNA® 2021.1 comparison based on AMD internal testing as of 09/27/2021 measuring the time to run the 3Cars, Car2Car, odbl0m-short, and Neon test case simulations. Configurations: 2x 64C AMD EPYC 7773X with AMD 3D V-Cache Technology ("Milan-X") versus 2x 64C AMD EPYC 7763 on the same AMD "Daytona" reference platform. Results may vary based on factors including silicon version, hardware and software configuration and driver versions. 3cars is the max result.
7Processor compatibility with EPYC 7003 powered platforms may require a BIOS update.
8MLNX-12: EPYC™ 7003 Processors with AMD 3D V-Cache have 768MB of L3 Cache, while EPYC 7003 processors without AMD 3D V-Cache have up to 256MB.
9EPYC-026: EPYC-026: Based on calculated areal density and based on bump pitch between AMD hybrid bond AMD 3D V-Cache stacked technology compared to AMD 2D chiplet technology and Intel 3D stacked micro-bump technology.
10MLNX-003C: ANSYS® Fluent® 2021.1 comparison based on AMD internal testing as of 09/27/2021 measuring the core solver rating for the Release 19 Rl test case simulations. Configurations: 2x 64C AMD EPYC 7773X with AMO 3D V-Cache Technology ("Milan-X") versus 2x 64C AMD EPYC 7763 on the same AMD "Daytona" reference platform. Results may vary based on factors including silicon version, hardware and software configuration and driver versions. Pump2 is the max result.
11Max boost for AMO EPYC processors is the maximum frequency achievable by any single core on the processor under normal operating conditions for server systems. EPYC-18
12MLNTC0-001: This scenario contains many assumptions and estimates and, while based on AMD internal research and best approximations, should be considered an example for information purposes only, and not used as a basis for decision making over actual testing. The AMD EPYC™ AMO 30 V-Cache™ VALUE ANALYSIS & GHG TOOL compares the selected AMD EPYC'M and Intel® Xeon® CPU based server solutions required to deliver a TOTAL_PERFORMANCE of 4600 jobs per day with Ansys® cfx-50 using the performance scores in this analysis for Intel Xeon and AMD EPYC CPU based servers. This estimation reflects a 3-year time frame.
This analysis compares a 2P AMD EPYC_7573X powered server with a Ansys® cfx-50 jobs per day of 484.67; to a 2P Intel Platinum_8362 based server with a Ansys® cfx-50 jobs per day of 239.51. A server powered by the EPYC_7573X can deliver up to 102% more jobs per day than the Platinum_8362 based server.
Both AMD EPYC and Intel based servers use the same cost for the following elements of the analysis: server chassis size of 2RU at a cost of $2500 per chassis; internal storage $380; physical servers managed per admin: 30; fully burdened cost per admin $110500; server rack size of 42; space allowance per rack of 27 sq feet; monthly cost of data center space $20 per sq foot; cost per kW for power $0.12; power drop per rack of 12kW; and a PUE (power usage effectiveness) of 1.7.
The AMD EPYC powered solution is estimated to take 10 total 2P EPYC_7573X powered servers at a hardware only acquisition cost of $19564 per server, which includes $5590 per CPU, total system memory of 1024GB, which is 16GB of memory/ core and a total system memory cost of $5504; internal storage cost of $380. The total estimated AMO EPYC hardware acquisition cost for this solution is $195640. Each server draws ~754kWhr per month. For the 3 years of this analysis the: EPYC total solution power cost is ~$55406 which includes the PUE factor; the total admin cost is ~$110499, and the total real estate cost is ~$19440 using 1 rack(s). The total 3-year TCO estimate for the EPYC solution is $370802.
The Intel based solution is estimated to take 20 total 2P Platinum_8362 powered servers at a hardware only acquisition cost of $20080 per server, which includes $5828 per CPU, total system memory of 1024GB, which is 16GB of memory/ core and a total system memory cost of $5504; internal storage cost of $380. The total estimated Intel hardware acquisition cost for this solution is $401600. Each server draws ~743kWhr per month. For the 3 years of this analysis the: Intel total solution power cost is ~$109203 which includes the PUE factor; the total admin cost is ~$221001, and the total real estate cost is ~$38880 using 2 rack(s). The total 3-year TCO estimate for the Intel solution is $750318.
AMD EPYC powered servers have a $379516 or 51% lower 3-year TCO. Delivering a minimum score of 4600 for Ansys® cfx-50 produces the following estimated results: the EPYC_7573X solution requires 50% fewer servers; takes 50% less RU space; 49% less power.
AMD EPYC_7573X powered servers save ~443315 kWh of electricity for the 3-years of this analysis. Leveraging this data, using the Country/ Region specific electricity factors from the '2020 Grid Electricity Emissions Factors vl.4 - September 2020', and the United States Environmental Protection Agency 'Greenhouse Gas Equivalencies Calculator', the AMD EPYC powered server saves ~203.19 Metric Tons of C02 equivalents. This results in the following estimated savings based on United States data, for any one of the following:
Greenhouse Gas Emissions Avoided:
44 USA Passenger Cars Not Driven for 1 year; or 15 USA Passenger Cars Not Driven Annually; or 510604 Miles Driven by Avg Passenger Car; or C02 Emissions Avoided from:
22960 Gallons of Gasoline Not Used; or
224520 Pounds of Coal Not Burned in USA; or
37 USA Homes' Electricity Use for 1 year; or 12 USA Homes' Electricity Use Annually; or Carbon Sequestered equivalent to:
3353 Tree Seedlings Grown for 10 years in USA; or
244 Acres of USA Forests in 1 year; or
81.27 Acres of USA Forests Annually.
The 2020 Grid Electricity Emissions Factors vl.4- September 2020 data used in this analysis can be found at https ://www.earbonfootprint.com/ docs/2020 _ 09 _ emissions _factors _sources_ for _2020 _electricity_ v14. pdf and the US EPA Greenhouse Gas Equivalencies Calculator used in this analysis can be found at https://www.epa.gov/energy/greenhouse-gas-equivalencies-calculator.
Pricing per CPU is lkU pricing for AMD and Intel published pricing at https://ark.intel.com/, January 2022. All pricing is in USO. All performance numbers are based on AMD internal testing, February 2022. AMO tests were run with pre-production Bl CPUs. Results generated by the: AMD EPYC AMD 3D V-Cache™ VALUE ANALYSIS & GHG TOOL: v3.10
13GD-204: "Technical Computing" or "Technical Computing Workloads" as defined by AMD can include: electronic design automation, computational fluid dynamics, finite element analysis, seismic tomography, weather forecasting, quantum mechanics, climate research, molecular modeling, or similar workloads.
14MLNX-032: World's highest performance x86 CPU for technical computing comparison based on AMD internal testing as of 2/14/2022 measuring the score, rating or jobs/day for each of estimated SPECrate®2017 _fp_base, Ansys Fluent, Altair Radioss and Ansys LS-Dyna application test case simulations average speedup on 2P servers running 32-core EPYC 7573X to 2P servers running 32-core Intel Xeon Platinum 8362 for per-core performance leadership and on 2P servers running top-of-stack 64-core EPYC 7773X to 2P servers running top-of-stack 40-core Intel Xeon Platinum 8380 for density performance leadership. "Technical Computing" or "Technical Computing Workloads" as defined by AMD can include: electronic design automation, computational fluid dynamics, finite element analysis, seismic tomography, weather forecasting, quantum mechanics, climate research, molecular modeling, or similar workloads. Results may vary based on factors including silicon version, hardware and software configuration and driver versions. SPEC®, SPECrate® and SPEC CPU® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.